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It is a negative-type resist material that combines extensibility.
The "STC Series" is an acrylic-based negative resist material that possesses the following characteristics: - Stretchability - High sensitivity - High transmittance - High adhesion - Low-temperature curing Please feel free to contact us if you have any inquiries.
We provide unique resist materials that leverage our proprietary acrylic resin design technology to contribute to the high functionality of advanced devices.
It can be customized to fit your needs and processes. Please feel free to contact us. ■ Photo spacer material - Good patterning properties; line width: 4μm to over 20μm - Thin film compatibility; height: 0.8μm to over 10μm - Low-temperature curing compatibility; firing temperature: ≧120℃ ■ Thick film resist material - Compatible with various shapes; columnar (dot), linear (L/S), lattice, dome-shaped, positive taper, negative taper - Thick film compatibility; height: 10μm to 100μm ■ Micro lens material - High transparency - Low-temperature curing compatibility; firing temperature: ≧100℃ ■ Insulating film material - High chemical resistance, high adhesion, high transparency - Low-temperature curing compatibility; firing temperature: ≧100℃ - Constant temperature and humidity resistance; 85℃/85%RH, 100 V, Ag or Cu wiring board, no change in resistance value for over 500 hours - Flexible compatibility available
We consolidate foundational technologies and know-how related to photoresist materials, which are essential for semiconductors, displays, printed circuit boards, and more.
This book covers a wide range of areas related to photoresist technology and is structured to provide meaningful content as a practical guide. Specifically, it comprehensively addresses photoresist materials, processes, evaluation and analysis, and processing equipment, including essential technologies for yield improvement and troubleshooting, such as pattern defects, to assist engineers dealing with photoresist materials. **Features of this book:** ➢ Essential resist materials for semiconductors, displays, printed circuit boards, etc. ➢ Broad coverage of photoresist materials, processes, evaluation and analysis, and processing equipment ➢ Aiming to acquire the fundamentals and know-how of technologies that can meet device product specifications ➢ Detailed descriptions of essential technologies for yield improvement and troubleshooting, such as pattern defects ➢ Supporting the resolution of challenges such as quality enhancement of photoresist materials and process optimization ➢ A functional book that consolidates foundational technologies and know-how related to photoresists
It is an acrylic-based negative photoresist material that can be produced in lens shapes.
The "PML series" is a negative resist material that enables pattern formation with lens shapes possessing the following characteristics: ■ High sensitivity: ≧ 50 mJ/cm² ■ High transmittance: ≧ 97% (Average @380~780 nm) *Please feel free to contact us if you have any requests.
It is a negative-type thick film resist material that can create patterns of various shapes.
The following is a negative-type thick film resist material with good exposure sensitivity and transmittance. ■ High sensitivity: ≧ 100 mJ/cm² ■ High transmittance: ≧ 90% (Average @ 380~780 nm) ■ Applicable to various exposure conditions and pattern shapes Thickness: 10-50 μm, line width: ≧ 10 μm, exposure wavelengths: g, h, i –line Please feel free to contact us if you have any inquiries.
This is a positive resist material that can be used in the dry etching process.
The "UPP Series" is a positive resist material for wiring formation applications, possessing the following characteristics and suitable for use in dry etching processes. ■ High sensitivity: ≧ 40 mJ/cm² ■ Good patterning performance: ≧ 4 μm ■ Good dry etching resistance *Please feel free to contact us if you have any inquiries.*
It is an acrylic negative photoresist material suitable for lift-off processes, capable of producing inverted taper shapes and hole patterns.
The "SA Series" is a negative-type resist material that can form an inverse taper shape and hole patterns with the following characteristics: ■ Capable of forming thick films: ≦ 20 μm ■ High sensitivity: ≧ 60 mJ/cm² ■ High heat resistance: ≦ 130℃ ■ Can be removed with organic solvents at room temperature *Please feel free to contact us if you have any requests.
![[Research Material] Global Market for ArF Dry and Immersion Resist Materials](https://image.mono.ipros.com/public/product/image/efb/2001468446/IPROS44398291432651818605.jpeg?w=280&h=280)
World Market for ArF Dry and Immersion Resist Materials: ArF Dry, ArF Immersion, Semiconductors and Integrated Circuits, Printed Circuit Boards
This research report (Global ArF Dry and Immersion Resist Materials Market) investigates and analyzes the current state and future outlook of the global market for ArF dry and immersion resist materials over the next five years. It includes information on the overview of the global ArF dry and immersion resist materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on ArF dry and ArF immersion, while the segments by application target semiconductors and integrated circuits, as well as printed circuit boards. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for ArF dry and immersion resist materials. It also includes the market share of major companies in the ArF dry and immersion resist materials sector, product and business overviews, and sales performance.
